Non-Silicone, Phase Change Thermal Interface Pads
THERMFLOW® phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.
Dual Phase Change Polymer Solder Hybrid Materials
Dual Phase Change Thermal Interface Materials consist of binder and fillers which both phase-change to exhibit the lowest thermal impedance of the phase-change family.