Thermal Pastes & Gels
Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP™ Gels are highly conformable, pre-cured, single component compounds. The cross-linked gel structure provides superior long term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink. They are supplied as pre-cured, single component compounds that can be dispensed over the heat generating component.
High-Performance and General Duty Thermal Greases
Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interfacial resistance. • T670 is offered with a very high bulk thermal conductivity of 3 W/m-K. Product offers low impedance as it will achieve a thin bondline of about 0.001 in. • T660 contains solder fillers for extremely low thermal impedance at thinner bondline thicknesses (down to about 0.001in.). • T650 is a general duty grease for typical applications.
THERM-A-FORM™ T64x and 164x Series
Cure-in-Place Potting and Underfill Materials
THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable formin-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.