Product Highlight: THERM-A-GAP™ PAD 70TP
Parker Chomerics THERM‐A‐GAP PAD 70TP is a high performance, highly conformable thermally conductive gap filler pad with 7.0 W/m‐K thermal conductivity. It provides superior thermal performance and long‐term stability over conventional thermal pads with very low compression force.
THERM‐A‐GAP PAD 70TP is designed to provide effective heat transfer between electronic components and their associated cooling features such as heat sinks. The physical properties of this gap pad allow it to exhibit very high conformability and minimize the compressive load on underlying electronics. “TP” in the product name stands for “Thermal Putty” indicating that, unlike other gap pads, this material is meant for static, one‐time assembly because it will permanently conform to displace air gaps caused by uneven surfaces or rough surface textures.
THERM‐A‐GAP PAD 70TP is offered as a standalone material, or with one of several carrier options; a woven glass carrier; either offset to one surface for a clean break feature (G carrier) or located approximately in the centre of the part thickness (F carrier), both offering improved tear resistance and easier handling. There is also an aluminium foil carrier (A carrier) option with a pressure sensitive acrylic adhesive (PSA) on one side.
Features and Benefits:
- High thermal conductivity 7.0 W/m-K
- Highly conformable, soft
- Low deflection force
- Electrically isolating
- Low oil bleeding
- One-time assembly
Typical Applications:
- Telecom Equipment
- PC board to chassis
- Thermally enhanced BGAs
- Memory packages & modules
- GPU & CPU
- Industrial Devices