This Is The Next Generation High Performing Thermal Gap Filler Pad
Looking for high thermal conductivity, yet ultra-soft thermal gap filler pad?
Then you’ll want to take a close look at THERM-A-GAP PAD 60, the next generation of high-performing thermal gap filler pads from Parker Chomerics.
High performance, low hardness
THERM-A-GAP PAD 60 offers the enticing combination of both excellent thermal conductivity at 6.0 W/m-K, at a softness of 31 Shore 00. This makes THERM-A-GAP PAD 60 more than 40% softer than current-like-performance thermal gap pads from Parker Chomerics.
The Shore 00 hardness scale covers very soft materials like rubbers, foams, sponges, and gels. A 31 Shore 00 result equates to approximately the hardness of a gel-like shoe insole. And with its elastomeric properties, PAD 60 bounces back after compression.
Low outgassing, greater usage than ever before
THERM-A-GAP PAD 60’s combination of high thermal conductivity and ultra-soft conformability, along with very low NASA outgassing, provides an effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps, and rough surface textures may exist.
TIMs play an ever-greater role in electronics packaging
The objective of thermal interface materials (TIMs) in electronics packaging is the efficient removal of heat from the semiconductor junction to the ambient environment.
While selecting a TIM for your application can be daunting, a popular material you should consider is thermal gap filler pads like THERM-A-GAP PAD 60.
Proven reliability and long-term stability
The thermal performance of THERM-A-GAP PAD 60 was examined after being subjected to multiple environmental stress tests. The thermal impedance of the aged samples did not experience a significant increase after any of the treatments studied. When a material’s thermal impedance is lower, the material is a better thermal conductor in that application.
THERM-A-GAP PAD 60 was subjected to 1000-hour dwell at 125°C, 1000-hour dwell at 85°C/85% relative humidity, and combined stress of thermal shock at -40°C to 80°C, thermal cycling at -40°C to 80°C, and random vibration frequencies equivalent to 2.0 gRMS.
In the three tests outlined below, there was no statistically significant increase in impedance according to a one-way analysis of variance (ANOVA) with Tukey's range test method for multiple comparisons.
Based on these results, THERM-A-GAP PAD 60 demonstrates the ability to withstand long-term aging without a reduction in thermal performance. See the official THERM-A-GAP PAD 60 Test Report for more details.
Long-term aging – thermal impedance
Long-term aging was performed on PAD 60 between stainless-steel substrates to evaluate the reliability of thermal performance over time.
The material was subjected to an extended dwell time of 1000 hours at 125°C, and long-term heat and humidity aging at 85°C and 85% relative humidity.
Long term aging – compression-deflection force
This test is intended to provide data on the deflection force recorded from compressing THERM-A-GAP PAD 60 after it is subjected to long-term aging. Material samples were subjected to a 1000-hour dwell at 125°C and a 1000-hour dwell at 85°C/85% relative humidity and combined stress of thermal shock at -40°C to 80°C, thermal cycling at -40°C to 80°C, and random vibration frequencies equivalent to 2.0 gRMS.
Total mass loss and outgassing
This test is intended to provide data on the volatile silicone content of THERM-A-GAP PAD 60. Volatile silicone is of concern due to its ability to migrate and cause problems in electronics applications.
The material was tested by thermogravimetric analysis (TGA) and by an independent outside laboratory. PAD 60 experienced a total mass loss of 0.034 % after a 3-hour dwell at 125°C.
The National Aeronautics & Space Administration (NASA) criteria for low-volatility materials limits the total mass loss (TML) to 1.0% and collected volatile condensable material (CVCM) to 0.10%.
Based on the independent laboratory results, PAD 60 passes the NASA outgassing criteria for low-volatility material.
Thermal gap filler pads can "blanket" multiple components with minimal stress all while reducing "hot spots" on a PCB. Be sure to read our blog post Selecting a Thermal Gel or Thermal Gap Pad – Your Questions Answered to help you decide with TIM is right for your application.
Parker’s new THERM-A-GAP PAD 60 is manufactured globally and available in standard sheet sizes and thicknesses and can easily be die-cut to custom dimensions and have various carrier and adhesive options for ease of use.